T M 9 - 4 9 3 1 - 3 8 1 - 1 4 & P - 2
CHAPTER 2
THERMAL SYSTEM TEST CONTROLLER
2-1.
General. This chapter contains job tasks that tell you how to repair the thermal system
test controller. The job tasks tell you how to remove and install components and assemblies of
the chassis assembly and case assembly. Defective components and assemblies removed from
the test controller are not covered in this manual for repair at this maintenance level. These
defective items are turned in for repair. Repair of the test controller at this maintenance
Ievel is done by replacing any bad components or assemblies that are found by good components
or assemblies.
2-2.
Equipment ltems Covered. Table 2-1 Iists the equipment items covered in this chapter.
The assemblies making up the thermal system test controller are listed along with the section
and page number where they are found in this chapter.
Table 2-1. Equipment ltems Covered
Paragraph
2-5
2-6
2-7
2-8
2-9
2-10
2-11
2-12
2-13
2-14
T i t le
Thermal System Test Controller Case
Panel Assembly A1
Digital Subsystem (DSS) Assembly A3
Image Display Unit (IDU) Simulator
Assembly A2
Power Module A6
Power Control Unit (PCU) A6A1
Electrical Load Bank A5
Electronics Unit (EU) A4
Front Panel Interface Connector Bracket
Chassis Assembly
Page
2-5
2-31
2-113
2- 157
2-206
2-267
2-272
2-310
2-314
2-323
2-3.
Equipment Items Not Covered. None
2-4.
General Maintenance Instructions. The following maintenance practices must be
followed any time you are working on the test set.
NOTE
Electrical connector repair kit 12285360 contains
instructions and tools needed for repair and replacement
of connectors, receptacles, contacts, and wires.
a. Soldering Techniques. Solder connections must be bright clean before soldering.
Remove dirt and grease from connections with freon (Item 13, appendix C) Type II and acid
swabbing brush (Item 8, appendix C). Solder (Item 29, appendix C) must be non acid type. Rosin
flux (Item 25, appendix C) should be used. All wires, parts, and solder iron must be pre-tinned
for good connection and maximum transfer of heat. Clean alI solder joints with acid swabbing
brush (Item 8, appendix
clean, bright surface.
C) and isoproyl alcohol (Item 17, appendix C) after soldering to obtain a
Volume IV
Para. 2-1
2-1
